Samsung and Qualcomm are teaming up to develop a new kind of CPU that uses organic materials to connect different layers of microcircuits. This technology, called an "organic bridge," is part of a packaging method known as 2.1D packaging. Unlike the more expensive 2.5D packaging, which often uses silicon, glass, or ceramic for connectivity, 2.1D packaging relies on organic materials to link microchip components. This approach is expected to be more cost-effective and easier to scale for mass production. The organic bridge is inspired by techniques used in printed circuit board (PCB) manufacturing. It is made from resins or polymers and serves as both a conductor and an insulator, connecting multiple microcircuit dies. This design aims to enhance data transfer speeds (bandwidth) while reducing manufacturing costs. It also helps alleviate supply chain challenges linked to the limited availability of silicon, a key material in traditional chip production. The development of this technology appears to have started in late 2024, with a patent for "interconnected bridge" technology filed around that time. The growing demand for AI data centers has increased the importance of efficient chip packaging, making 2.1D packaging a promising solution for advancing artificial intelligence capabilities. Samsung is not the only company exploring 2.1D packaging. Other firms, including those mentioned in the Korean publication TheElec, are showing interest in developing chips using this method. The article suggests that Samsung's subsidiary, Samsung Electro-Mechanics, may be collaborating with other companies to advance 2.1D packaging technology. This indicates that the approach is gaining traction as a way to address the rising costs and energy needs of AI processing. Other major chip manufacturers, such as Intel Foundry Services and TSMC, are also working on 2.1D packaging. TSMC, which previously dominated the 2.5D packaging market, has now expanded into 2.1D technology. While Samsung and Qualcomm have been collaborating for the past year, it may still be some time before AI chips using 2.1D packaging reach mass production.