A research team led by Professor Minkee Choi from the Department of Chemical and Biomolecular Engineering at KAIST, in partnership with Samsung Electronics, has created a new catalyst that effectively removes tetrafluoromethane (CF₄), a powerful greenhouse gas used in semiconductor manufacturing. This innovation was published in the prestigious chemistry journal Angewandte Chemie International Edition in June 2026. Tetrafluoromethane, or CF₄, is a potent contributor to climate change, with a global warming potential over 6,000 times greater than that of carbon dioxide. It can remain in the atmosphere for up to 50,000 years. In semiconductor manufacturing, CF₄ is used in processes like dry etching, where it is typically broken down at high temperatures using steam and a catalyst. However, traditional catalysts have struggled in this environment because the hydrogen fluoride (HF) produced during decomposition causes them to degrade. This degradation leads to the catalyst's particles clumping together or its structure changing, reducing its effectiveness over time. To overcome this challenge, the research team employed a novel approach called "entropy stabilization." This method involves creating a complex, disordered structure by mixing multiple types of atoms, which makes the material more resistant to changes in structure. The team combined several metals—aluminum (Al), zinc (Zn), gallium (Ga), nickel (Ni), and cobalt (Co)—into a single aluminate crystal structure, forming an "entropy-stabilized aluminate (ESA) catalyst." This new catalyst remains stable and functional even under harsh conditions involving high temperatures, moisture, and fluorine. In tests, the new catalyst showed significantly better performance. Its ability to break down CF₄ was about 2.3 times greater than that of a traditional alumina catalyst. When tested at around 800°C (1,470°F) for 150 hours, the conventional catalyst's performance dropped from 93% to 48% in converting CF₄, while the new ESA catalyst only decreased from 98% to 92%. The researchers also studied the decomposition process using oxygen isotopes, revealing that the catalyst uses its internal oxygen first and then replenishes it with oxygen from surrounding steam, acting like an "oxygen refill system." This research is significant not only for the development of a more effective catalyst but also for introducing a new design strategy that can be applied to a variety of catalysts used in semiconductor manufacturing. By adjusting the types and combinations of metals, this approach could lead to more efficient and durable catalysts for treating different process gases in the future.