Samsung, TSMC, and Intel have announced plans to use ASML's High NA extreme ultraviolet (EUV) lithography technology to manufacture more advanced chips. This technology allows for the creation of smaller and more complex transistors on silicon wafers, which is essential for improving the performance and efficiency of modern electronics. Samsung and TSMC plan to implement the technology by 2028 and 2030, respectively, while Intel has already started using it for its 18A process in select processors like the Core Ultra Series 3 (Panther Lake). ASML is also developing an advanced version, called 18A-P, which Apple is reportedly considering for its next-generation A-series iPhone processors. Intel has already produced over a million wafers using this new process. The three companies are also launching a new initiative to switch from the current standard of six-inch photomasks to larger 12-inch photomasks. These photomasks act like stencils, transferring intricate chip designs onto silicon wafers during the manufacturing process. The shift to larger masks is expected to improve factory productivity, reduce manufacturing costs, and eliminate the need for "stitching," a process that adds complexity and expense. With larger masks, companies can print more detailed chip features onto larger chips without the need for stitching. ASML plans to begin testing 12-inch photomask production facilities in 2031, with full production expected to start by 2033. Samsung intends to use High NA EUV technology for manufacturing DRAM memory chips by 2028, while TSMC plans to integrate the technology into its most advanced chipmaking processes starting in 2030. SK Hynix, another major chipmaker, is currently evaluating whether to join the effort. ASML's chief technology officer, Marco Pieters, noted that if the industry successfully adopts the new technology, it could boost the productivity of manufacturing systems by up to 40 percent. However, both Samsung and TSMC may face challenges in scaling up to the new technology, which could impact their ability to meet planned production timelines. The transition to High NA EUV and larger photomasks represents a significant step forward in semiconductor manufacturing. These advancements are crucial for sustaining Moore's Law, which predicts that the number of transistors on a chip will double approximately every two years. As chipmakers push the limits of miniaturization, the collaboration between leading semiconductor companies and equipment suppliers like ASML will be key to maintaining progress in the industry.